Description
Product Introduction
Semiconductor punching blades are cutting tools designed specifically for the semiconductor industry. They are mainly used to accurately punch holes in silicon wafers, thin film materials, and other semiconductor raw materials during the production process. They are widely used in integrated circuit (IC) packaging, LED production, fiber optic connector manufacturing, and other fields.
Product Features
High Precision
Semiconductor punching blades can achieve micron-level aperture precision punching, with a tolerance of ±0.005 mm. Compared with ordinary mechanical tools, its accuracy has increased by about 18%. This high precision enables it to meet the strict requirements for aperture size consistency in semiconductor packaging, microelectronics manufacturing, and other fields, reducing rework and waste caused by cutting errors.
High Temperature Resistance
Semiconductor punching blades can withstand temperatures up to 1100°C, far exceeding the 600-700°C temperature resistance limit of traditional steel tools. In the temperature cycle from 400°C to 900°C, the dimensional stability of semiconductor punching blades is 40% higher than that of traditional tools, and the deformation rate is reduced by 65%.
Strong Corrosion Resistance
The surface of the semiconductor punching blade has a 2μm thick TiN (titanium nitride) coating. After 1000 hours of salt spray test (5% NaCl solution, 35°C), the corrosion depth of the blade surface does not exceed 0.001mm, while ordinary blades will have a corrosion depth of more than 0.1mm after 200 hours.
FAQ
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